説明
説明なし構成
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEMモデルの説明
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.ドキュメント
ドキュメントなし
ACCRETECH / TSK
PG300RM
検証済み
カテゴリ
Polishing and Grinding
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56213
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG300RM
検証済み
カテゴリ
Polishing and Grinding
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56213
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEMモデルの説明
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.ドキュメント
ドキュメントなし