説明
Fully automatic in-feed surface grinder/polisher構成
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEMモデルの説明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.ドキュメント
ドキュメントなし
DISCO
DGP8760
検証済み
カテゴリ
Polishing and Grinding
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72740
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2009
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Logistics Support
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Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DGP8760
検証済み
カテゴリ
Polishing and Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72740
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Fully automatic in-feed surface grinder/polisher構成
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEMモデルの説明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.ドキュメント
ドキュメントなし