説明
説明なし構成
構成なしOEMモデルの説明
The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
P-12XLm
検証済み
カテゴリ
Probers
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
100942
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
P-12XLm
検証済み
カテゴリ
Probers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
100942
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.ドキュメント
ドキュメントなし