説明
UBM DEP構成
構成なしOEMモデルの説明
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)ドキュメント
ドキュメントなし
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
128165
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 300
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
128165
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
UBM DEP構成
構成なしOEMモデルの説明
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)ドキュメント
ドキュメントなし