説明
説明なし構成
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEMモデルの説明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.ドキュメント
ドキュメントなし
PERKIN ELMER
4400
検証済み
カテゴリ
PVD / Sputtering
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
67776
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示PERKIN ELMER
4400
カテゴリ
PVD / Sputtering
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
67776
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEMモデルの説明
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.ドキュメント
ドキュメントなし