説明
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.構成
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEMモデルの説明
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.ドキュメント
ドキュメントなし
カテゴリ
PVD / Sputtering
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
148404
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPUTTERED FILMS INC / SFI
ENDEAVOR AT
カテゴリ
PVD / Sputtering
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
148404
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.構成
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEMモデルの説明
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.ドキュメント
ドキュメントなし