説明
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.構成
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEMモデルの説明
提供なしドキュメント
ドキュメントなし
ULVAC
SME-200J
検証済み
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
110833
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
SME-200J
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
110833
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.構成
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEMモデルの説明
提供なしドキュメント
ドキュメントなし