CENTURA AP ISPRINT
概要（Overview）
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
現在の掲載品
2
サービス
検査、保証、鑑定、ロジスティクス
