説明

Sikama UP4000 Ultra Profile 4000 Reflow Solder/Curing Oven The Unit's Serial Number Tag Reads: Model: Ultra Profile 4000 Serial Number: 02-43-034 Power Requirements: 208 VAC, 3-Phase, 50-60 Hz, 16.8 kW @ 240 VAC CE Marked: Yes Description: Sikama International's versatile Ultra Profile 4000 Solder Reflow oven combines bottom-up conduction with top-down convection heat, precise temperature calibration and purity of atmosphere. The oven can be used as a stand-alone unit or as part of of an automated assembly line using the SMEMA communication standard. It offers multiple load and unload configurations ensuring that it can fit even the most constrained production floors. The Ultra Profile 4000 is a twelve-zone system with 7 heat zones and 5 cool zones. It features a liquid-cooled load and unload platform, top and bottom conduction plus convection heat zones, and cool zones utilizing liquid cooling. Each top and bottom heat zone has independent set point and gas flow controls to ensure consistent temperatures for greater profile flexibility. The internal cooling zone ensures a process cool-down in an inert atmosphere prior to the product exiting to the offload platform. Parts are transported through the system using sweep bars or walking beams that operate in a "dwell" (timed delay) mode allowing adjustable cycle times. The walking bream transport system minimizes any wear on both components and machine. The system may be operated with air, nitrogen, or forming gas. The gas flow enters the chamber through small orifices in the top and bottom heated platens and exits the sides to prvent contamination of adjoining zones and minimize flux buildup. In addition to heating inert gas, the top platens contribute radiant heat to the reflow process and are easily adjustable to accomodate a broad range of component heights while maintaining accurate temperatures and atmospheres. Capable of heating up to 752°F (400°C), the UP4000 is targeted at applications involving die soldering, BGAs, flip chips, and insulated metal core substrates. The oven may also be used for processing high-densitity components and substrate materials ranging from copper to ceramice to beryllium, and glass epoxy. The oven is ideally suited for lead frames and Auer Boats. The UP4000 efficiency of operation and minimal use of electricity and gas, along with small footprint are the results of Sikama's unique design for balanced heating and cooling.

構成

Specifications: Heating Zones: 7 Cooling Zones: 4 Load/Unload Buffers: Standard Zone Temperatures: 400°C ±2°C (752°F) Direction of Flow: Multi-directional Transport System: Sweeping Bar / Walking Beam (WB) Automation: SMEMA / SECS/GEM Minimum O2 Level: 10 PPM Substrate Capacity: Min/Max Dimensions: No Min., 12" L x 3.9" W (305 mm x 99 mm) Max. Maximum Height: 4" (102 mm) Maximum Weight: 1 lbs. (0.45 kg) - If all zones used Facility Requirements: Input Voltage: 220 VAC / 380 VAC Input Current: ≤ 70 A @ Start-up, @le; 35 A @ Steady state System Power: 17 kW @ Start-up, ≤ 8.5 kW @ Stready state Total Cover Gas Rate: ≤ 5.8 CFM Cooling Water Flow: ≤ 2 GPM Dimensions: 38" W x 72" D x 56" H (97 cm x 183 cm x 142 cm)