KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

KLA-Tencor Corp. has introduced two new enhancements for reticle and photomask inspection: the Advanced Performance Algorithm (APA) and the STARlight High Resolution (HR) option. These enhancements enable accurate and reliable inspection of next-generation 0.25-m reticles, including those with complex optical proximity correction (OPC) geometries. APA is a new feature for the RAPID 300 Series reticle pattern inspection systems, while HR is a new option for the STARlight reticle contamination inspection systems. The STARlight HR option uses the smallest pixel size available in any contamination inspection system to deliver the inspection sensitivity required for 0.25-m lithography. This feature will help increase the lithography process window for both mask shops and wafer fabs by capturing contaminants and particles, even semi-transparent defects, such as stains and transmission errors before they impact wafer production. STARlight HR is available on all SL300, SL301, and SL351 systems as a factory or field upgrade option.

SL300

SLF17

The KLA 301 Reticle Inspection System and the KLA 50 Reference Data Computer together form the KLA 351 Inspection System, which represents a major advance in speed, sensitivity and flexibility. The KLA 351 offers the highest inspection sensitivity available in the marketplace, which the Company believes is vital to meet reticle inspection requirements for today's more complex microprocessors and larger DRAMs. This dedicated image processor employs a flexible system architecture which permits future upgrades and enhancements through software, rather than hardware changes. Furthermore, the KLA 351's optics include a rotating telescope turret to provide three sensitivities in one system. The KLA 351 offers flexibility for users who need a versatile inspection system to address the inspection needs of both the most demanding and the more routine semiconductor manufacturing processes. Users may obtain higher throughput by selecting lower sensitivity inspections.

The 597XR is an older model from KLA Tencor, developed specifically for a particular market or customer (custom tool). In this case, the product may have been discontinued or is no longer actively promoted, which is why detailed information is not available on the official website or in public documentation.

597XR

For SL301, the STARlight HR (High Resolution) option is available as a factory or field upgrade. It uses the smallest pixel size available in any contamination inspection system to deliver the inspection sensitivity required for 0.25-m lithography. This feature will help increase the lithography process window for both mask shops and wafer fabs by capturing contaminants and particles, even semi-transparent defects, such as stains and transmission errors before they impact wafer production.

SL301

The KLA-221 Automatic Reticle and Photomask Inspection System allows you to inspect photomasks, multi-die reticles, single-die reticles and glass wafers for both random and repeating defects. This versatile, high­ performance production system employs both die-to-die and die-to-database inspection technology. 

The TeraStar SLF27, a key member of the Tera family, provides a three-fold increase in throughput compared to previous generation systems, and can detect critical killer defects as small as 100nm--making it ideal for inspecting advanced multi-die reticles used in high-volume IC production.

SLF27

HM 220

SLF77

SLF87

TCP 8530M

MRW 200

SL515

20 model II

SL437-HR

The KLA-Tencor STARlight™ SL3UV is a product that provides comprehensive UV contamination inspection for deep ultra-violet (DUV) lithography. It assures reticle quality throughout the manufacturing process and their productive life in wafer fabrication. This is necessary due to the increased complexity of reticle manufacturing and new inspection challenges introduced by subwavelength lithography.

SL3UV URSA

STARlight

SL586H-T3

SL303UV

GX 520

SL437

The KLA-224 Automatic Reticle Inspection System is designed for dedicated, high-volume reticle inspection applications. This system gives you extremely high throughput on SX and 1 OX reticles, and provides repeating defect inspection for photomasks and multi­die reticles. 

SL331

 The 353UV automated reticle inspection system was introduced which allows for ultraviolet-based inspection providing the sensitivity levels necessary on complex reticles designed for deep UV lithography applications.

353UV

MES 313-02

The KLA 301 Reticle Inspection System and the KLA 50 Reference Data Computer together form the KLA 351 Inspection System, which represents a major advance in speed, sensitivity and flexibility.

SL597-XR

The 365UV-HR, a new high numerical aperture ("NA") reticle pattern inspection tool for deep ultraviolet ("DUV"), sub-wavelength lithography. The 365UV-HR provides the advanced reticle inspection capabilities necessary for both high-volume manufacturing of 0.18-micron devices and early development of 0.13-micron processes. 

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

KLA

概要（Overview）

現在の掲載品

全ての製品

サービス

トップKLA Reticle / Mask Inspection

SLF17

351

597XR

SL300

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

すべてのKLA Reticle / Mask Inspection