説明
Pictures attached were taken before tool was crated.構成
構成なしOEMモデルの説明
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.ドキュメント
ドキュメントなし
SEMILAB / SDI
FAAST 230 DP+SPV
検証済み
カテゴリ
Reticle / Mask Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled / Crated
製品ID：
27530
ウェーハサイズ：
不明
ヴィンテージ：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB / SDI
FAAST 230 DP+SPV
カテゴリ
Reticle / Mask Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled / Crated
製品ID：
27530
ウェーハサイズ：
不明
ヴィンテージ：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Pictures attached were taken before tool was crated.構成
構成なしOEMモデルの説明
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.ドキュメント
ドキュメントなし