説明
Indexer(indexer board) process chamber (process kits, CM, Top matcher, bottom matcher) Transfer (dip board , auto tune board PS1,PS2)構成
TCP9408OEMモデルの説明
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.ドキュメント
ドキュメントなし
LAM RESEARCH CORPORATION
TCP 9400
検証済み
カテゴリ
RIE
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
92147
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
TCP 9400
カテゴリ
RIE
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
92147
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Indexer(indexer board) process chamber (process kits, CM, Top matcher, bottom matcher) Transfer (dip board , auto tune board PS1,PS2)構成
TCP9408OEMモデルの説明
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.ドキュメント
ドキュメントなし