説明
説明なし構成
200C - 1300C temperature Two process chambers Details are attached below. This tool was converted from a MATTSON Helios RF200 (300mm tool) to its current state of a MATTSON Helios C200 (200mm tool). Unique Wafer Stress Management Capabilities: -Wafer double-side heating for best wafer stress management -RTP process for different substrate thickness Superior Solution for Pattern-Loading Effect: -Wafer double-side heating coupled with proven DTEC control technology -Elimination of wafer-loading effect in RTP processes Wide RTP Applications: -200°C – 1300°C temperature range, from ultra-low -temperature NiSi anneal to ultra-high temperature -Wafer engineering -Best metal contamination performance for CMOS -Sensor fabrication -Excellent ambient control capability, O < 1 ppm -High power incandescent lamp, long lifetime High Productivity System Platform: -Two process chambers -High speed wafer transfer -Small footprint -More than 300 platforms installed worldwide Product Applications: -Power IC, CMOS Sensor, MEMS, Logic, LED: -Post-implant ion activation -Ultra-shallow-junction formation -Metal silicide formation -High temperature anneal Wafer Manufacturing: -High temperature wafer substrate annealOEMモデルの説明
The Helios C200 RTP system combines superior technical performance with outstanding tool reliability. It is the ideal RTP solution for 200 mm semiconductor development and manufacturing.ドキュメント
カテゴリ
RTP/RTA
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68083
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MATTSON
HELIOS C200
カテゴリ
RTP/RTA
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68083
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available