ACCRETECH next generation systems support optimum device productions.

The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.

ACCRETECH / TSK

A-WD-200T

Wafer Dicing Machine - The full automatic wafer dicing machine with the face-to-face twin-spindles, ready for the 300 mm wafer.

A-WD 300T

The A-WD-5000A is a high-speed, high-precision machine that boasts the world’s smallest size. It features a database of optimum machining conditions, a multi-function design that considers expandability, and an energy-saving design. This machine is designed to provide the best possible performance while minimizing its environmental impact.

A-WD-5000A	

A-WD-300TX

Optimized spacing by utilizing all components and optional unit well within the compartment
Standard Spindles up to 60,000 rpm
(80,000 rpm as optional)
Enhanced throughput
①X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec
②Two Optical Cutter-Set units
③The Worlds’ smallest blade-to-blade distance
17” LCD touch panel and new GUI
GUI（Graphical User Interface)　with simple layout and large touch-buttons allow users’ interactive operation
Easy and simple Kerf check function
(AI kerf check function)
Over 10,000 recipes storable
USB port as standard
(USB memory device can be used as external memory)
Ease-of-maintenance
Wide maintenance door and front-side accessibility allows easy of routine maintenance
Optimized vacuum controller
Reduces 50% of air consumption compared with existing model

AD3000T

The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.

A-WD-10A

A-WD-100M

AD20T

ML200Plus

A-WD-250S

A-WD-208T

AD20S

SS10 

A-WD-100A

12” Separator for stealth laser diced 12” wafer

SEP300

ML300PlusX-WH

SS20

The AD2000T is a fully automatic dicing machine for 200mm wafers made by ACCRETECH / TSK. It is the smallest dicing machine in the world and has the highest space efficiency. It also has a low cost of ownership and a high processing speed, with the X-axis up to 1,000 mm/sec and the Y-axis up to 300 mm/sec. The AD2000T has several features, including a refined Graphic User Interface with a Help function and an easy and simple Kerf check function. It also has a standard spindle up to 60,000 rpm, with an optional high-speed spindle up to 80,000 rpm. The machine is designed for easy maintenance, with a wide maintenance door and front-side accessibility.

AD2000T

ML300PlusX-FHWH

PS280

ML300Plus-WH

SS30

8” Separator for stealth laser diced 8” wafer

SEP200B

ML301EX-WH

ML200

A-WD-10B

ML300EX-FHWH

ML300

ML300PlusX-RM

ML300EX

AL300P

ML300-RM

PS300

ML300EX-FH

A-WS-100A

AD3000T-HC PLUS

The W-SL-300 is a Wire Saw Slicing Machine that is designed for high-throughput slicing of plural wafers at a time. It is capable of slicing large-diameter ingots up to 300 mm, providing high-precision and high-processing quality while maintaining high-productivity. Additionally, the W-SL-300 is an economical machine with a small footprint and low running costs, making it an ideal choice for businesses looking to maximize their efficiency and productivity.

W-SL-300

ML300EX-WH

The C-RW-200A is a Sliced Wafer Carbon Demounting and Cleaning Machine. It is designed to automatically demount wafers from the slicing base, clean them, and store them into a cassette. This machine streamlines the process of handling sliced wafers, making it more efficient and reducing the risk of damage to the wafers.

C-RW-200A

A-WD 300TLDP

A-WD-75A

ML300Plus-FHWH

ML300Plus-RM

ML300Plus-FH

A-WS-100B

AD3000T-PLUS 

The A-WD-300 is a wafer dicing machine that is the world’s smallest 300 mm fully-automatic wafer dicing machine. It has substantially improved throughput with the installation of the twin-spindle and boasts a total accuracy of 4 µm. With its compact size and high precision, the A-WD-300 is a powerful tool for wafer dicing.

A-WD-300

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ACCRETECH / TSK

概要（Overview）

現在の掲載品

全ての製品

サービス

トップACCRETECH / TSK Scribing, Cutting, Dicing

A-WD-200T

A-WD 300T

A-WD-5000A

A-WD-300TX

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

すべてのACCRETECH / TSK Scribing, Cutting, Dicing