説明
Packaging products/wafer dicing machines 6-8-10 inch plate構成
構成なしOEMモデルの説明
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.ドキュメント
ドキュメントなし
ADVANCED DICING TECHNOLOGIES (ADT)
7900
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
103702
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANCED DICING TECHNOLOGIES (ADT)
7900
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
103702
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Packaging products/wafer dicing machines 6-8-10 inch plate構成
構成なしOEMモデルの説明
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.ドキュメント
ドキュメントなし