説明
Packaging products/wafer dicing machines 6-8-10 inch plate構成
構成なしOEMモデルの説明
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.ドキュメント
ドキュメントなし
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
103702
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANCED DICING TECHNOLOGIES (ADT)
7900
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
103702
ウェーハサイズ：
6"/150mm, 8"/200mm
ヴィンテージ：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Packaging products/wafer dicing machines 6-8-10 inch plate構成
構成なしOEMモデルの説明
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.ドキュメント
ドキュメントなし