説明

DISCO DAD321 Automatic Dicing Saw Manufacturer: DISCO Model: DAD321 Equipment Type: Automatic Dicing Saw Maximum Wafer Size: 6 inch (150 mm) Spindle Configuration: Single Spindle Spindle Type: Air Bearing Spindle Power: 1.5 kW Spindle Speed: 3,000–40,000 rpm X-axis Cutting Range: 192 mm Y-axis Cutting Range: 162 mm Z-axis Stroke: 32 mm Index Resolution: 0.0001 mm Theta-axis Rotation: 380 degrees Blade Size: 2 inch (standard configuration) Power Supply: 200 VAC, 3-phase Maximum Power Consumption: 2.5 kVA Machine Dimensions: 500 × 1,050 × 1,455 mm Machine Weight: Approx. 500 kg Automatic precision dicing saw designed for cutting silicon wafers and glass substrates. Specifications may vary depending on machine configuration.

構成

構成なし

OEMモデルの説明

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

ドキュメント

ドキュメントなし

DISCO

DAD321

検証済み

カテゴリ

Scribing, Cutting, Dicing

最終検証： 8日前

主なアイテムの詳細

状態：

Used

稼働ステータス:

Deinstalled

製品ID：

153599

ウェーハサイズ：

不明

ヴィンテージ：

1997

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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