説明
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.構成
構成なしOEMモデルの説明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.ドキュメント
ドキュメントなし
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DISCO
DAD321
カテゴリ
Scribing, Cutting, Dicing
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
140558
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.構成
構成なしOEMモデルの説明
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.ドキュメント
ドキュメントなし