説明
Wafer Dicing Saw構成
構成なしOEMモデルの説明
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.ドキュメント
ドキュメントなし
DISCO
DAD3350
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72605
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DAD3350
カテゴリ
Scribing, Cutting, Dicing
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
72605
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wafer Dicing Saw構成
構成なしOEMモデルの説明
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.ドキュメント
ドキュメントなし