説明
説明なし構成
Process: Wafer Dicing Mode: Fully-autoOEMモデルの説明
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.ドキュメント
ドキュメントなし
DISCO
DAD3360
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116465
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DAD3360
カテゴリ
Scribing, Cutting, Dicing
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116465
ウェーハサイズ：
8"/200mm, 12"/300mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Process: Wafer Dicing Mode: Fully-autoOEMモデルの説明
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.ドキュメント
ドキュメントなし