説明
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.構成
構成なしOEMモデルの説明
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."ドキュメント
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DISCO
DAD641
カテゴリ
Scribing, Cutting, Dicing
最終検証： 9日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
153663
ウェーハサイズ：
不明
ヴィンテージ：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.構成
構成なしOEMモデルの説明
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."ドキュメント
ドキュメントなし