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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DAD651
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.
    ドキュメント

    DISCO

    DAD651

    verified-listing-icon

    検証済み

    カテゴリ
    Scribing, Cutting, Dicing

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    Installed / Idle


    製品ID:

    105088


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DAD651

    DISCO

    DAD651

    Scribing, Cutting, Dicing
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    DISCO

    DAD651

    verified-listing-icon
    検証済み
    カテゴリ
    Scribing, Cutting, Dicing
    最終検証: 60日以上前
    listing-photo-7c621e5e97f849af88ca2ca336473828-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    Installed / Idle


    製品ID:

    105088


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.
    ドキュメント
    同様のリスト
    すべて表示
    DISCO DAD651

    DISCO

    DAD651

    Scribing, Cutting, Dicingヴィンテージ: 0状態: 中古最終検証:60日以上前
    DISCO DAD651

    DISCO

    DAD651

    Scribing, Cutting, Dicingヴィンテージ: 0状態: 中古最終検証:60日以上前
    DISCO DAD651

    DISCO

    DAD651

    Scribing, Cutting, Dicingヴィンテージ: 0状態: 中古最終検証:60日以上前