説明
Fully automatic dual-spindle dicing saw構成
Workpiece / Spindles: Up to 300mm (12in); dual spindle Alignment / Cleaning: Automatic alignment; spinner cleaning, rinsing and drying Handling: Automated Cassette -> Alignment -> Cutting -> Cleaning -> Cassette Reference Spindle: Half-cut Manual: 1.2kW, 6,000-60,000 rpm, 2 in blade Installed Configuration: Spindle power / blade size / half-cut option: not confirmed Reference Scope: Half-cut manual values are reference only; installed options unverified Application / Process: Wafer Singulation; back-endOEMモデルの説明
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.ドキュメント
ドキュメントなし
同様のリスト
すべて表示
DISCO
DFD6360
カテゴリ
Scribing, Cutting, Dicing
最終検証： 2日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
154433
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Fully automatic dual-spindle dicing saw構成
Workpiece / Spindles: Up to 300mm (12in); dual spindle Alignment / Cleaning: Automatic alignment; spinner cleaning, rinsing and drying Handling: Automated Cassette -> Alignment -> Cutting -> Cleaning -> Cassette Reference Spindle: Half-cut Manual: 1.2kW, 6,000-60,000 rpm, 2 in blade Installed Configuration: Spindle power / blade size / half-cut option: not confirmed Reference Scope: Half-cut manual values are reference only; installed options unverified Application / Process: Wafer Singulation; back-endOEMモデルの説明
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.ドキュメント
ドキュメントなし