説明
Wafer Dicing Saw構成
構成なしOEMモデルの説明
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.ドキュメント
ドキュメントなし
DISCO
DFD6363
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116265
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6363
カテゴリ
Scribing, Cutting, Dicing
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116265
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wafer Dicing Saw構成
構成なしOEMモデルの説明
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.ドキュメント
ドキュメントなし