説明
説明なし構成
Process: Wafer Dicing Mode: Fully-autoOEMモデルの説明
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.ドキュメント
ドキュメントなし
DISCO
DFD641
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116468
ウェーハサイズ：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
ヴィンテージ：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFD641
カテゴリ
Scribing, Cutting, Dicing
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116468
ウェーハサイズ：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
ヴィンテージ：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Process: Wafer Dicing Mode: Fully-autoOEMモデルの説明
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.ドキュメント
ドキュメントなし