説明
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.構成
構成なしOEMモデルの説明
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DISCO
DFD650
カテゴリ
Scribing, Cutting, Dicing
最終検証： 8日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Deinstalled
製品ID：
153628
ウェーハサイズ：
不明
ヴィンテージ：
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし