説明
説明なし構成
InoperativeOEMモデルの説明
The Disco DFD691 has a maximum workpiece handling size of an ø8" wafer and is equipped with a 2.2 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 76.2 mm and has a parallel dual-spindle configuration. The machine also features enhanced productivity with automatic alignment and is suitable for semiconductor, ceramic, and glass applications. It offers process methods such as dual cut and step cut & bevel cut, which effectively reduces front and backside chipping and improves die strength.ドキュメント
ドキュメントなし
DISCO
DFD691
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
62716
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD691
カテゴリ
Scribing, Cutting, Dicing
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
62716
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
InoperativeOEMモデルの説明
The Disco DFD691 has a maximum workpiece handling size of an ø8" wafer and is equipped with a 2.2 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 76.2 mm and has a parallel dual-spindle configuration. The machine also features enhanced productivity with automatic alignment and is suitable for semiconductor, ceramic, and glass applications. It offers process methods such as dual cut and step cut & bevel cut, which effectively reduces front and backside chipping and improves die strength.ドキュメント
ドキュメントなし