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DISCO DFL7160
    説明
    説明なし
    構成
    – Laser Maximum Power: 18 W – Laser Wavelength: 355 nm – 50/60Hz, 3 Phase, 14amps
    OEMモデルの説明
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
    ドキュメント

    ドキュメントなし

    DISCO

    DFL7160

    verified-listing-icon

    検証済み

    カテゴリ
    Scribing, Cutting, Dicing

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    44876


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, Dicing
    ヴィンテージ: 2009状態: 中古
    最終確認60日以上前

    DISCO

    DFL7160

    verified-listing-icon
    検証済み
    カテゴリ
    Scribing, Cutting, Dicing
    最終検証: 60日以上前
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/a72d4f8385f44492a2d72d773882ab5a_489bb91634f94376aec885d5b65dc756908ab66dba2845b2ab7a1e33430df5601105cf_mw.jpeg
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/a4459ee9344a402186cab4bec01e5fe7_9ed8d2c0cccd491abb93168375ed0034dbd4d5f96a75499fa89f3fd91c3546231201af_mw.jpeg
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/2100fa726e2a4a88a9b74e4f0c9256ce_452689db4a494acfb19fd3cb2a94be682f2dde1b983e4ee7af8ae913a7904eb4f_mw.jpeg
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/01fee89f35e345a1a1d1d5f44c954e18_93275929e1fe4268960c60788190b7af523de2f9dc5c495e9c6f83e7e42b96881201af_mw.jpeg
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/c308056cf4cc415093314f886241d4b2_ec1724b2130c4ee7bc933e132c1f370102d3e453676f45d28cc9fc89f908dca9f_mw.jpeg
    listing-photo-64eb668deb454fff8ddb720d70850d3f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/64eb668deb454fff8ddb720d70850d3f/ef5166d6c4e74be3b077fc15ce328164_b9f633cce8314bbe94a4000b07b575bf86a304e4a90b405b983f845e383178ef1201af_mw.jpeg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    44876


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    – Laser Maximum Power: 18 W – Laser Wavelength: 355 nm – 50/60Hz, 3 Phase, 14amps
    OEMモデルの説明
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, Dicingヴィンテージ: 2009状態: 中古最終検証:60日以上前
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, Dicingヴィンテージ: 2008状態: 中古最終検証:60日以上前
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, Dicingヴィンテージ: 2005状態: 中古最終検証:60日以上前