説明
Dicing HDD X構成
SawOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
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DISCO
DFL7340
カテゴリ
Scribing, Cutting, Dicing
最終検証： 今日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
112378
ウェーハサイズ：
4"/100mm
ヴィンテージ：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Dicing HDD X構成
SawOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし