説明
Laser Dicing Saw構成
構成なしOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし
DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
96645
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFL7340
カテゴリ
Scribing, Cutting, Dicing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
96645
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Laser Dicing Saw構成
構成なしOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし