説明
説明なし構成
Processing method: Stealth dicing Workpiece size: φ8" X-axis (Chuck table) Processing range: 210mm Max. processing speed: 1 - 1,000mm/sec Y-axis (Chuck table) Processing range: 210mm Index step: 0.0001mm Positioning accuracy: 0.003/310mm (Single error)0.002/5mm Y-axis (Z2axis processing point) Processing range Index step Positioning Z-axis Moving resolution: 0.0001mm Repeatability accuracy: 0.001mm Θ-axis (Chuck table) Max. rotating angle: 380degOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
25194
ウェーハサイズ:
不明
ヴィンテージ:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
25194
ウェーハサイズ:
不明
ヴィンテージ:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available