説明
Process: Saw Wafer Size: 4inch (Sapphire Glass) Main Controller: Hitachi HJ-4030-NOJSA LASER: HAMAMATSU Laser Type: SDE Laser Maximum Power: 2W Laser Wavelength: 1045nm Servo Drive: Panasonic x 6ea構成
構成なしOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし
DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
53894
ウェーハサイズ:
不明
ヴィンテージ:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
53894
ウェーハサイズ:
不明
ヴィンテージ:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Process: Saw Wafer Size: 4inch (Sapphire Glass) Main Controller: Hitachi HJ-4030-NOJSA LASER: HAMAMATSU Laser Type: SDE Laser Maximum Power: 2W Laser Wavelength: 1045nm Servo Drive: Panasonic x 6ea構成
構成なしOEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし