説明
Inventory構成
Max. Workpiece size mm ø200 Processing method Fully automatic X-axis Max. feed speed mm/s 1.0 - 1,000 Y-axis Positioning accuracy mm Within 0.003/210 Utilities Dimensions (WxDxH) mm 950 x 1,732 x 1,800 Weight kg Approx. 1,800OEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし
DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
15984
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示DISCO
DFL7340
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
15984
ウェーハサイズ:
不明
ヴィンテージ:
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Inventory構成
Max. Workpiece size mm ø200 Processing method Fully automatic X-axis Max. feed speed mm/s 1.0 - 1,000 Y-axis Positioning accuracy mm Within 0.003/210 Utilities Dimensions (WxDxH) mm 950 x 1,732 x 1,800 Weight kg Approx. 1,800OEMモデルの説明
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.ドキュメント
ドキュメントなし