説明
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.構成
Chuck/table size (Has 12 inch spec now) - Usage : Laser Diode - 1306.60 Hrs. Laser Head - 19082.40 Hrs. - Laser Source Type : SD06 typeOEMモデルの説明
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.ドキュメント
DISCO
DFL7362
カテゴリ
Scribing, Cutting, Dicing
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
128847
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available