説明
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.構成
構成なしOEMモデルの説明
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.ドキュメント
ドキュメントなし
DISCO
DFL7362
カテゴリ
Scribing, Cutting, Dicing
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
128847
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.構成
構成なしOEMモデルの説明
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.ドキュメント
ドキュメントなし