DISCO DFL7362.mov

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

2017
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
Φ300 mm        Stealth Dicing™       SDBG       SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

DISCO

DFL7362

Scribing, Cutting, Dicing

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