DTX-MDB 150
概要（Overview）
The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
