説明
6S Auto AOI After Saw Singulation with Wafer Sorter -Pickup force: 50~150g -Dimension: 2950(W)x1550(D)x1650(H) mm /x 2130mm(H) withmsignal tower / weight < 3800Kg構成
-Machine Cycle Time: ≦ 0.6 sec/chip (exclude process time) -Accuracy: X,Y= ± 40μm , θ=± 0.2° -Chip size: 0.7mm～10 mm (option: customized) -Die Thickness: 0.10 mm～0.7 mm (2mil Option) -Wafer Size: 12” Standard (8” Option) -Wafer Load/Unload: Automatic -Mapping: Easy mapping / file mapping -Ejector Needle: Dual needle unit / Programmable Speed & Height control Option Function: -Topside /Backside insp. Chipping, Crack, Residue glue , defect size>10um -Side wall inspection Chipping, Crack, defect size>10um (option) -inspection resolution 2.7um/pixel -Wafer Ring for place 12” Standard (8” Option) feeding by 12” XY table -Ring Load/Unload 12” wafer ring auto load/unload by Cassette -NG die output Place bad die(by inspection)on tray for rework or -review (Option: 6” film frame) -Barcode reader For mapping file confirming -SECS For mapping data transfer (option)OEMモデルの説明
提供なしドキュメント
GMM
6S
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
46623
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
GMM
6S
カテゴリ
Scribing, Cutting, Dicing
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
46623
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available