説明
• Field Proven 3D Vision Sensing Technology • High Resolution 3D sensing technology • Built-in Fiducial camera & lighting • Great for Demanding Assemblies • 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes • 3D shaded view for examining solder paste deposits • Registration Measurement • Bridge Detection for Fine Tune printer setup/monitor process drift • XML format output • Adjustable-width, clamping conveyor systems • CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive • Dimensions (h x w x d) 200 x 98 x 125 • Weight 860 kg (1900 lbs.) • Panel Size Capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) • Maximum Panel Weight: 3 kg (6.6 lb.) • Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top 2.5 mm (0.10 in.) Bottom 3 mm (0.12 in.) • Underside Component Clearance: 25.4 mm (1 in.) • Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec) • Conveyor Height: 889 to 990 mm (35 to 39 in.) • Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II • Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.) • Maximum Pad Size: in 5 x 10 mm • FOV (0.197 x 0.394 in.)構成
構成なしOEMモデルの説明
CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.ドキュメント
ドキュメントなし
CYBER OPTICS
SE300 Ultra
検証済み
カテゴリ
Solder Paste Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68919
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CYBER OPTICS
SE300 Ultra
カテゴリ
Solder Paste Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
68919
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
• Field Proven 3D Vision Sensing Technology • High Resolution 3D sensing technology • Built-in Fiducial camera & lighting • Great for Demanding Assemblies • 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes • 3D shaded view for examining solder paste deposits • Registration Measurement • Bridge Detection for Fine Tune printer setup/monitor process drift • XML format output • Adjustable-width, clamping conveyor systems • CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive • Dimensions (h x w x d) 200 x 98 x 125 • Weight 860 kg (1900 lbs.) • Panel Size Capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) • Maximum Panel Weight: 3 kg (6.6 lb.) • Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top 2.5 mm (0.10 in.) Bottom 3 mm (0.12 in.) • Underside Component Clearance: 25.4 mm (1 in.) • Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec) • Conveyor Height: 889 to 990 mm (35 to 39 in.) • Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II • Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.) • Maximum Pad Size: in 5 x 10 mm • FOV (0.197 x 0.394 in.)構成
構成なしOEMモデルの説明
CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.ドキュメント
ドキュメントなし