説明

TECHNICAL SPEC FOR Spray system FSI Mercury Model: FSI Mercury MP Standard or dual exhaust: CORZAN exhaust with process exhaust monitoring Wafer size: 6 inch Chemicals used: - Canister console one with: o Canister H2SO4 o Canister NH4OH - Canister console two with: o H2O2 - Canister console exhaust monitoring installed - 4 x paddlewheel flow pick up (H2SO4; NH4OH; H2O2 and DIMIX) Turntable style: 6” Turntable with 6 positions 240V operation Motor and motor speed controller: - LC4CP11001 motor controller PN: 3690-01678 - Brushless Servomotor Pacific Scientific PN: 409244-003 Booster pump: Not installed Helios: HELIOS 400VAC 52KW IR Heater: Not installed Ti T/C's: TC’s installed in Helios heater. Do not know if those are Titanium TC’s? Vertical lift kit: No lift installed Center SP etch probe: Dual etchprobe installed SBSP: Sidebowl spraypost installed SBSP Etch probe: Not installed Manifold type: Single manifold with 4 flow controllers installed Recirculation: No recirculation installed Photohelic monitor: Photohelic process exhaust monitoring and canister exhaust monitoring MHS: Unknown Dual canister rotary board: Unknown Autofill: Autofill option installed Direct feed: Process applications: Equipment was used for RESIST STTRIPPING and SALICIDE WET ETCH. Particle performance and process SPC tests where in control. SECS: SECSII communication installed Missing parts: none Defected parts: none Software: 9.94 Operating system: 486 CPU PCB

構成

Wafer cleaning and/or wet resist strip (SPM)

OEMモデルの説明

The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.