説明
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system構成
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEMモデルの説明
提供なしドキュメント
ドキュメントなし
カテゴリ
Support Equipment
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
154854
ウェーハサイズ：
不明
ヴィンテージ：
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SCIENTECH
Pyxis 3001-TDB
カテゴリ
Support Equipment
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
154854
ウェーハサイズ：
不明
ヴィンテージ：
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system構成
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEMモデルの説明
提供なしドキュメント
ドキュメントなし