説明
Measurement system構成
Vacuum chuck: 23.3 mm (small) and 33.4 mm (large) (2) Cassettes: 100 mm / 125 mm / 150 mm / 200 mm Wafer throughput: ~ 60 wafers/hour (150 mm) and ~ 45 wafer/hour (200 mm) Film thickness (Minimum): 5600 (150 mm) and 8700 (200 mm) Film thickness accuracy: ± 1.00 μm, 250 μm ~ 750 μm Topography test: 5600 (150 mm) and 8000 (200 mm) Topography test accuracy: ± (3.00+5% reading) μm (150 mm) and ± (4.00+5% reading) μm (200 mm) Topography test range: (950-t) μm ~ 650 μm Flatness test accuracy: ± 0.5 μm Flatness repeatable test deviation: 0.2 μm Stress repeatable test deviation: 1 x 10^7 dynes/cm² Stress test range: 1 × 10^7 ~ 1.4 x 10^12 dynes/cm² Film thickness test area: Within 3/5 mm (wafer edge) Topography test area: Within 3 mm (wafer edge) Operation Calibration Maintenance Safety manuals Paper and electronic documentation Gage controller Power supply: 120 V, 2.8 kVA, 50-60 HzOEMモデルの説明
The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.ドキュメント
ドキュメントなし
KLA / ADE
ULTRAGAGE 9500
検証済み
カテゴリ
Thin Film / Film Thickness
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
109981
ウェーハサイズ：
4"/100mm, 8"/200mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
KLA / ADE
ULTRAGAGE 9500
カテゴリ
Thin Film / Film Thickness
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
109981
ウェーハサイズ：
4"/100mm, 8"/200mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Measurement system構成
Vacuum chuck: 23.3 mm (small) and 33.4 mm (large) (2) Cassettes: 100 mm / 125 mm / 150 mm / 200 mm Wafer throughput: ~ 60 wafers/hour (150 mm) and ~ 45 wafer/hour (200 mm) Film thickness (Minimum): 5600 (150 mm) and 8700 (200 mm) Film thickness accuracy: ± 1.00 μm, 250 μm ~ 750 μm Topography test: 5600 (150 mm) and 8000 (200 mm) Topography test accuracy: ± (3.00+5% reading) μm (150 mm) and ± (4.00+5% reading) μm (200 mm) Topography test range: (950-t) μm ~ 650 μm Flatness test accuracy: ± 0.5 μm Flatness repeatable test deviation: 0.2 μm Stress repeatable test deviation: 1 x 10^7 dynes/cm² Stress test range: 1 × 10^7 ~ 1.4 x 10^12 dynes/cm² Film thickness test area: Within 3/5 mm (wafer edge) Topography test area: Within 3 mm (wafer edge) Operation Calibration Maintenance Safety manuals Paper and electronic documentation Gage controller Power supply: 120 V, 2.8 kVA, 50-60 HzOEMモデルの説明
The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.ドキュメント
ドキュメントなし