説明
Thin Film Thickness Measurement構成
構成なしOEMモデルの説明
The NanoSpec 9300 is a stand-alone, automated thin film measurement system that can handle both 200 and 300 millimeter diameter wafers. It can be configured with a DUV to NIR spectroscopic ellipsometer for ultrathin, multiple film stack, and DUV lithography measurement applications. Additionally, an FTIR option can be added to measure the thickness of epi-silicon. The system can also include a mini-environment enclosure and wafer load ports that are compatible with industry standards. The 9300 conforms to the new industry standards for 300 millimeter wafer handling automation and features a Windows NT software platform that conforms to the newly established SEMI user interface standard. The 9300 was developed using technologies from integrated film thickness systems, allowing for easy transfer of measurement recipes between integrated and stand-alone film metrology systems.ドキュメント
ドキュメントなし
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9300
検証済み
カテゴリ
Thin Film / Film Thickness
最終検証： 23日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115101
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9300
カテゴリ
Thin Film / Film Thickness
最終検証： 23日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115101
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Thin Film Thickness Measurement構成
構成なしOEMモデルの説明
The NanoSpec 9300 is a stand-alone, automated thin film measurement system that can handle both 200 and 300 millimeter diameter wafers. It can be configured with a DUV to NIR spectroscopic ellipsometer for ultrathin, multiple film stack, and DUV lithography measurement applications. Additionally, an FTIR option can be added to measure the thickness of epi-silicon. The system can also include a mini-environment enclosure and wafer load ports that are compatible with industry standards. The 9300 conforms to the new industry standards for 300 millimeter wafer handling automation and features a Windows NT software platform that conforms to the newly established SEMI user interface standard. The 9300 was developed using technologies from integrated film thickness systems, allowing for easy transfer of measurement recipes between integrated and stand-alone film metrology systems.ドキュメント
ドキュメントなし