説明

説明なし

構成

Equipment hardware configuration No. Item Specification Description 1 Equipment Name Wafer stress testing equipment 2 Equipment Model FLX-2320R 3 wafer size 75-200mm wafers, 4 Measurement range 1-4000Mpa (10000A thin film, wafer thickness 725um ) 5 temperature room temperature 6 Transmission method Manual Manual wafer handling 7 Drawing methods automatic 8 Scan range 200mm 9 Scanning accuracy 0.01mm 0.02mm 10 Measurement reproducibility 1.3 MPa (1 sig) Standard slice calculation (previous value x5 + subsequent value x5) 11 Computer System 1. Intel dual-core 64 -bit processor, Windows 10 operating system . 3.6GHz processor, 16GB RAM, 1TB hard drive 2. >17-inch LCD monitor and mouse/keyboard Windows 11 operating system 12 Image processing 1. Features two-dimensional image display. 2. It has 3D mapping capabilities. 13 Operating software 1. Possesses data management and storage functions. 2. Supports English user interface 3. Has three levels of management authority. 4. Includes equipment alarm records and operation records. 5. Program size ≥ 3 14 Calibration tools Standard calibration tools and samples are provided *1 Provide calibration films 15 Attachment Tools One set of maintenance tools will be provided . No maintenance tools 16 Manual (English version) 1. User Manual *1 2. A maintenance manual will be provided . 3. Repair Manual *1 4. Provide a spare parts list