説明
説明なし構成
構成なしOEMモデルの説明
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.ドキュメント
ドキュメントなし
EVGroup (EVG)
GEMINI
検証済み
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
Deinstalled
製品ID：
102684
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
EVGroup (EVG)
GEMINI
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
Deinstalled
製品ID：
102684
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.ドキュメント
ドキュメントなし