説明
WAFER BONDING構成
構成なしOEMモデルの説明
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.ドキュメント
ドキュメントなし
EVGroup (EVG)
GEMINI FB
検証済み
カテゴリ
Wafer Bonders
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107777
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
GEMINI FB
カテゴリ
Wafer Bonders
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
107777
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
WAFER BONDING構成
構成なしOEMモデルの説明
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.ドキュメント
ドキュメントなし