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説明
説明なし構成
-Unit setup for thermal bonding and hot embossing. -Windows 2000 -Unit setup for thermal bonding, not anodic bonding. -Will need to hook it to a three phase power source and compressed air/ nitrogen. -Fully operational -Last used in 2019OEMモデルの説明
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonderドキュメント
EVGroup (EVG)
EVG520 HE
検証済み
カテゴリ
Wafer Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
55796
ウェーハサイズ:
8"/200mm
ヴィンテージ:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示EVGroup (EVG)
EVG520 HE
カテゴリ
Wafer Bonders
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
55796
ウェーハサイズ:
8"/200mm
ヴィンテージ:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available