![EVGroup (EVG) EVG520](https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-large.png)
説明
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm構成
構成なしOEMモデルの説明
Wafer Bonderドキュメント
ドキュメントなし
EVGroup (EVG)
EVG520
検証済み
カテゴリ
Wafer Bonders
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
105029
ウェーハサイズ:
不明
ヴィンテージ:
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示EVGroup (EVG)
EVG520
カテゴリ
Wafer Bonders
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
105029
ウェーハサイズ:
不明
ヴィンテージ:
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm構成
構成なしOEMモデルの説明
Wafer Bonderドキュメント
ドキュメントなし