説明
Condition: Complete / Working Status: Installed / Running構成
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEMモデルの説明
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonderドキュメント
ドキュメントなし
EVGroup (EVG)
EVG850 LT
検証済み
カテゴリ
Wafer Bonders
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113644
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 LT
カテゴリ
Wafer Bonders
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113644
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Condition: Complete / Working Status: Installed / Running構成
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEMモデルの説明
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonderドキュメント
ドキュメントなし