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説明
Wafer Cleaner構成
構成なしOEMモデルの説明
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.ドキュメント
ドキュメントなし
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
104999
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG301
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
104999
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wafer Cleaner構成
構成なしOEMモデルの説明
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.ドキュメント
ドキュメントなし