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説明
説明なし構成
構成なしOEMモデルの説明
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.ドキュメント
ドキュメントなし
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
83923
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
ТВМ-8
カテゴリ
Wafer Bonders
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
83923
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.ドキュメント
ドキュメントなし