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6" Fab For Sale from Moov - Click Here to Learn More
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SUSS MicroTec / KARL SUSS SB8 Gen2
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder
    ドキュメント

    ドキュメントなし

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Bonders

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    92362


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    SUSS MicroTec / KARL SUSS SB8 Gen2

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    Wafer Bonders
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Bonders
    最終検証: 60日以上前
    listing-photo-5f6d896826f44b13b895116d6c185db0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    92362


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    SUSS MicroTec / KARL SUSS SB8 Gen2

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    Wafer Bondersヴィンテージ: 0状態: 中古最終検証:60日以上前